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LANGUAGE
PRODUCT SPECIFICATION
ENGLISH
6.0
INFRARED RELOLW CONDITIONS
3 deg C/sec Max
Item
Resistance to
soldering Heat
Test Condition
( INFRARED SOLDERING CONDITION )
T E MP E R A T U R E C O N D I T I O N G R A P H
260 deg C (PEAK TEMP.)
T E MP E R A T U R E O N B O A R D P A T T E R N S I D E
TW ICE
200 deg C min.
40sec Min
cooling in still
230 deg C Min
60~120 sec
( Pre-heat 150~180deg C )
(NOTE)
1. Please check the reflow soldering condition by your own devices beforehand
2. Thickness of the cream solder shall be maintained 0.12mm MIN.
After reflow process.
Because the condition changes by the soldering devices, P.C.Boards, and so on.
Requirement
Appearance: No Damage .
After 2 times of
reflow
A
REV
REVISE ON PC ONLY
SEE SHEET 1
DESCRIPTION
TITLE
SD MEMORY CARD CONNECTOR FOR CARD
HEADER WITH EJECTOR MECHANISM
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX
INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
DOCUMENT NO.
DIMENSION CLASS:
FILE NAME
SHEET
PS-67913-002
C
RITICAL
=0
MAJOR = 0
PS-67913-002.
PDF
7
.PDF
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